Nano-Tungsten Powder for Electronic Package Alloy Material
- Trademark: kinna
- Origin: China
INFORMATION: Particle size:<100nm Purity:>99.9% Countenance: Roundness
High-Efficiency Fuel Catalyst
Aerospace, Large Naval ship and other High-End Equipment in Military and Civil Fields.
Electronic Package Alloy Material
Materials for Electronic Package, Electrode, Microelectronic Film, Gas Sensor and other Devices
Precision Mold and Powder metallurgy
Reduce the sintering temperature (1200 ºC) of tungsten products, decrease the 800 ºC than conventional tungsten powder sintering temperature (2000 ºC). Density of tungsten block more than 95%, reduce subsequent sintered tungsten products, such as rotary forging process.
Can be used for the preparation of nano tungsten carbide powder